in July 2003, fully private & independent, debt free.
• inNOVAtive PACKaging & interconnect company
in Europe for microelectronics and opto-electronics.
• Individuals with 20+ years of micro-electronics packaging
• Service from early design-in of new & custom packaging or
interconnect all the way to chip assembly & test.
• Sourcing, Procurement and Quality follow-on to turnkey
• A headquarter in Grenoble area since 2007
• Member of MINALOGIC cluster
• Provide to
the European microelectronics, nanoelectronics, and opto-electronics industry
- cost competitive materials, packaging & interconnect solutions from qualified and certified manufacturing lines,
- European wide and multi-lingual support,
- outsourcing “backend” headaches,
- large vision of existing solutions,
- a specialty for non-standard ideas,
- creativity from mixing individual technologies and resources.
• Be the GLUE between all the piece-part actors.