Ceramic
   • Al or Cu Metallised Al203 and AlN substrates
   • “Micro-DBC” technology
   • LTCC
   • Dielectric, Resistor and conductive pastes for screen printing

Inkjet
   • Nanoparticules suspensions : Ag, Au, Pt
   • InkJet Printer
   • Inkjettable ceramic/metal inks
   • 3D mono and multi-material Inkjet printing services

Photovoltaic
   • Conductive pastes Ag, Ag-Pd
   • Inkjetted front Ag inks and printing services

Organic substrates
   • LGA, BGA, micro-via substrates,
   • SIP interconnects

3D Plastic cavity packages & lids
   • Plastic rings, interposers and Lids
   • Pre-molded cavity packages based on Advanced Liquid Crystal Polymers (LCP)
   • Metallised interconnects on plastics (full metallisation for shielding, or proprietary selective method)

Thermal Management
   • Al or Cu carbon fibre composites
   • Al or Cu Diamond composites
   • Al - Si Particles composite
   • 3D Custom Shaping and plating finish
   • Thermal Interface Material (TIM) using Low Temperature Sintering Technology for die attach and assembly materials
   • “Micro-DBC” technology

Assembly Materials & Services
   • Fast turn around chip assembly (from wafer sawing to sealing),
   • Plastic Air cavity, LGA, BGA or even ceramic assemblies,
   • Materials for Die attach (NCA, ICA), Balling (flip chip)
   • Thermal Interface Material (TIM) using Low Temperature Sintering Technology for die attach and assembly materials   
   • Die processing or bumping using inkjet microfabrication