who we are
inNOVAtive PACKaging & interconnect company in Europe for microelectronics;
Founded in 2003, fully private and independent.
Individuals with 30+ years of experience in IC packaging, hermetic and non hermetic, standard, tailored or full custom, micro-injection moulding and high precision machining to print.
Conveniently located in the heart of the Microelectronics valley in the French Alps, near Grenoble and Lyon Airport/TGV hub.
We welcome unusual requests and creative ideas